
Gigabyte X570S AORUS ELITE AX Ryzen Gaming Motherboard
Unleash the Power of Ryzen with AORUS The GIGABYTE X570S AORUS Elite AX Motherboard supports AMD Ryzen 5000 Series/ 4000 Series/ 3rd Gen/ 2nd Gen Processors. Experience unparalleled performance with PCIe 4.0 support, lightning-fast data transfer speeds, and advanced cooling solutions. Specificati...
*Price sourced from Amazon.com. Last updated:Jun 04, 2026.Price and availability are subject to change.
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Overview
Unleash the Power of Ryzen with AORUS
The GIGABYTE X570S AORUS Elite AX Motherboard supports AMD Ryzen 5000 Series/ 4000 Series/ 3rd Gen/ 2nd Gen Processors. Experience unparalleled performance with PCIe 4.0 support, lightning-fast data transfer speeds, and advanced cooling solutions.
Specifications:
- CPU Support: AMD Ryzen 5th Gen/ 4th Gen/ 3rd Gen/ 2nd Gen
- Memory: Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
- VRM: Twin 12+2 Phases Digital VRM Solution with 60A DrMOS
- Thermal Design: Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
- Wireless: AMD WiFi 6E 802.11ax & BT 5.2
- Storage: Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guards
- LAN: Fast 2.5GbE LAN with Bandwidth Management
- USB: SuperSpeed USB 3.2 Gen 2x2 TYPE-C® (up to 20Gb/s)
- Audio: AMP-UP Audio with ALC1220-VB and WIMA Audio Capacitors
- Cooling: Smart Fan 6 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- RGB: RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
- BIOS: Q-Flash Plus Update BIOS without CPU, Memory, Graphics Card
Key Features
Supports AMD Ryzen 5th Gen/ 4th Gen/ 3rd Gen/ 2nd Gen
Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
Twin 12+2 Phases Digital VRM Solution with 60A DrMOS
Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
AMD WiFi 6E 802.11ax & BT 5.2
Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guards
Fast 2.5GbE LAN with Bandwidth Management
SuperSpeed USB 3.2 Gen 2x2 TYPE-C delivers up to 20Gb/s transfer speeds
AMP-UP Audio with ALC1220-VB and WIMA Audio Capacitors
Smart Fan 6 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
Specifications
Pros & Cons
👍 Pros
- Supports a wide range of AMD Ryzen processors, including 5th, 4th, 3rd, and 2nd Gen, offering versatile CPU compatibility.
- Features Dual Channel ECC/Non-ECC Unbuffered DDR4 with 4 DIMMs, providing flexibility for memory configurations.
- Equipped with a Twin 12+2 Phases Digital VRM Solution and 60A DrMOS, ensuring stable power delivery for demanding components.
- Boasts a Fully Covered Thermal Design with High Coverage MOSFET Heatsinks, effectively managing heat for consistent performance.
- Integrates AMD WiFi 6E 802.11ax and BT 5.2 for cutting-edge wireless networking and peripheral connectivity.
- Offers Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 slots with Thermal Guards, maximizing storage speed and preventing thermal throttling.
- Includes Fast 2.5GbE LAN with Bandwidth Management, providing high-speed wired internet for gaming and data transfer.
- Features SuperSpeed USB 3.2 Gen 2x2 TYPE-C, delivering extremely fast transfer speeds of up to 20Gb/s for external devices.
- Incorporates AMP-UP Audio with ALC1220-VB and WIMA Audio Capacitors, enhancing sound quality for an immersive experience.
- Includes Smart Fan 6 with Multiple Temperature Sensors and Hybrid Fan Headers, offering advanced cooling control and quiet operation.
👎 Cons
- While supporting multiple Ryzen generations, specific compatibility with future CPU releases is not guaranteed without further updates.
- The motherboard’s extensive feature set, including advanced VRM and cooling, might lead to a higher price point compared to entry-level options.
- Utilizing all triple NVMe PCIe slots might require careful planning to avoid potential bandwidth sharing limitations with other components.
- The "Fast 2.5GbE LAN" is a step up from standard Gigabit, but not as fast as 10GbE solutions found on some higher-end boards.
- The comprehensive thermal design, while beneficial for cooling, may also contribute to the board's overall size and weight, potentially impacting case compatibility.