
G.Skill F3-2133C10D-8GXM 8GB DDR3 Desktop Memory
High-Performance Memory for Gaming and OverclockingThe G.SKILL Ripjaws X Series memory kit delivers exceptional speed and reliability for gaming, content creation, and demanding applications. With its optimized DDR3 design and high clock speeds, this memory module enhances system performance and ...
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Overview
High-Performance Memory for Gaming and Overclocking
The G.SKILL Ripjaws X Series memory kit delivers exceptional speed and reliability for gaming, content creation, and demanding applications. With its optimized DDR3 design and high clock speeds, this memory module enhances system performance and responsiveness.
Specifications:- Capacity: 8GB (2 x 4GB)
- Memory Type: DDR3
- Speed: 2133 MHz (PC3 17000)
- Form Factor: 240-pin DIMM
Key Features
DDR3 2133(PC3 17000)
Timing 10-12-12-31
Cas Latency 10, Voltage 1.6V
Compatible with Intel LGA1155 platformsIntel XMP support for 2nd and 3rd Generation Intel Core Processors
240-Pin DDR3 SDRAM
Specifications
Pros & Cons
👍 Pros
- Operates at a high clock speed of 2133 MHz (PC3 17000), contributing to faster system performance.
- Features a CAS Latency of 10, indicating a relatively quick response time for memory operations.
- Designed with Intel XMP support for 2nd and 3rd Generation Intel Core Processors, simplifying overclocking.
- Compatible with Intel LGA1155 platforms, ensuring broad compatibility for specific motherboard chipsets.
- The 240-Pin DDR3 SDRAM form factor is standard for many desktop systems, facilitating installation.
👎 Cons
- This RAM operates at 1.6V, which is slightly higher than the standard 1.5V for some DDR3 modules, potentially requiring BIOS adjustment.
- Only compatible with Intel LGA1155 platforms and specific generation Intel Core Processors, limiting its use in other systems.
- DDR3 technology is older, meaning this module may not be suitable for newer systems that require DDR4 or DDR5 RAM.
- The 8GB capacity may be insufficient for users running very demanding applications or extensive multitasking scenarios.
- Specific heat spreader design or low-profile features are not detailed, which could be a factor in tight build spaces.