Intel

Intel SR19H Xeon E5-2697 V2 Processor (Renewed)

4.4 (9 reviews)

Twelve Ivy Bridge-EP cores at 2.7GHz with 30MB L3 cache and dual-socket LGA 2011 support — the Xeon E5-2697 V2 still builds a formidable compute node at a fraction of its original cost.

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*Price sourced from Amazon.com. Last updated:Jun 04, 2026.Price and availability are subject to change.

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Overview

The Intel Xeon E5-2697 V2 is a 12-core Ivy Bridge-EP processor operating at 2.7GHz base with Turbo Boost, mounting on the LGA 2011 socket and designed for dual-socket deployments on C600-series server platforms. The 30MB L3 cache — 2.5MB per core — is a meaningful architectural advantage for workloads that benefit from keeping large working sets resident in cache rather than incurring DRAM latency. QPI interconnect at 8 GT/s ensures low-latency coherency between sockets in a dual-processor configuration. At 130W TDP, this is a full-power server-class processor; the thermal design requires appropriate server-grade cooling infrastructure but reflects the compute density being delivered.

In the renewed market, the E5-2697 V2's relevance is primarily in cost-per-core compute density. A dual-socket LGA 2011 board with two of these processors yields 24 physical cores and 48 threads — a virtualization density that would cost multiples more at current-generation Xeon pricing. Render farms, Kubernetes clusters, large-scale compilation builds, and machine learning inference workloads that benefit from thread count over single-thread performance are the primary use cases. The platform's constraints — DDR3 memory bandwidth, PCIe 3.0, and end-of-life chipset support — are real ceilings for storage- or GPU-intensive workloads, but for CPU-bound parallel compute, the E5-2697 V2 in a dual-socket configuration remains a rational infrastructure choice when budget is the primary variable.

Specifications

Brand
Intel
Model
Xeon E5-2697 V2
Core Count
12 Cores / 24 Threads
Base Clock
2.7GHz
L3 Cache
30MB
Socket
LGA 2011
TDP
130W
QPI Speed
8 GT/s
Multi-Socket
Dual-socket capable
Condition
Renewed

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Pros & Cons

👍 Pros

  • 12 physical cores / 24 threads per socket enables high-density virtualization and parallel compute workloads at the renewed price point
  • 30MB L3 cache reduces DRAM access frequency for cache-resident workloads — measurable latency benefit for database and analytics tasks
  • Dual-socket capable: two E5-2697 V2 units on a supported board yield 24 cores / 48 threads for a fraction of current-gen Xeon pricing
  • 8 GT/s QPI interconnect maintains low-latency inter-socket communication in dual-socket configurations
  • 130W TDP is managed effectively in server-class chassis with proper active cooling infrastructure

👎 Cons

  • LGA 2011 is a legacy platform — compatible boards are available used only; no new motherboard production for this socket
  • 130W TDP demands server-class active cooling that adds cost and noise to a home lab deployment
  • DDR3 memory (as used on LGA 2011 Romley platforms) is slower than current DDR4/DDR5 — memory bandwidth is the key performance ceiling for this platform
  • No PCIe 4.0 or 5.0 support — PCIe 3.0 at LGA 2011 limits NVMe SSD throughput and modern GPU bandwidth
  • Renewed condition means the chip has prior operational hours — verify the renewal process and warranty terms before deployment in production

Frequently Asked Questions

LGA 2011 socket — compatible with Intel C600/C602 series chipset platforms, including boards based on the Romley-EP architecture. Common compatible boards include Supermicro X9DRi, ASRock EP2C602, and similar dual-socket server platforms. Verify your specific board's QVL before purchasing.
30MB of L3 cache across 12 cores (2.5MB per core) reduces memory access latency for cache-resident workloads — database queries, in-memory analytics, and virtualization guest data sets benefit from this cache size because frequently accessed data avoids slower DRAM reads.
Yes — the E5-2697 V2 is a dual-socket capable Xeon. In a dual-socket LGA 2011 server board, two units provide 24 physical cores / 48 threads, which is a compelling density for virtualization and rendering nodes even by current standards.
130W TDP — this is a high thermal envelope processor. It requires an active CPU cooler rated for 130W+; standard desktop coolers are not appropriate. Server platforms using this chip typically employ active air cooling with a heatsink rated for the Xeon TDP.
Yes — at the renewed pricing, a dual E5-2697 V2 build delivers 24-core compute density at a cost per core that's difficult to match with current-generation hardware. Memory bandwidth via quad-channel DDR3 and QPI interconnect at 8 GT/s supports memory-intensive workloads efficiently.