Intel

Intel SR19W Xeon E5-2667 v2 3.30GHz 8-Core CPU (Renewed)

Eight cores at 3.30 GHz base and 4.00 GHz turbo with 25MB Smart Cache — the E5-2667 v2 delivers high-clock Ivy Bridge-EP workstation performance at a fraction of its original cost.

$63.00*
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*Price sourced from Amazon.com. Last updated:Jun 03, 2026.Price and availability are subject to change.

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Overview

The Intel Xeon E5-2667 v2 is the clock-speed-optimized variant of the Ivy Bridge-EP E5-2600 v2 lineup, with a 3.30 GHz base frequency and 4.00 GHz single-core turbo — the highest in the family — at the cost of an elevated 130W TDP. The 8-core, 16-thread configuration with 25MB of shared L3 cache sits at the intersection of per-core frequency and core count: it wins in lightly-threaded workloads where raw clock speed matters, while the 25MB cache reduces main memory round-trip latency for datasets that fit within it. Two QPI links at 8 GT/s make it a legitimate dual-socket processor, enabling 16-core, 32-thread platforms on compatible LGA2011 server boards. Four-channel DDR3/DDR3L ECC support provides the memory reliability required for production workstation and server deployments.

The E5-2667 v2 targets buyers building or upgrading LGA2011-platform workstations on a constrained budget — 3D rendering nodes, database servers, virtualization hosts, and scientific computing workstations where Ivy Bridge-EP's per-core performance and 2P scalability still deliver practical throughput at today's renewed prices. It is not a forward-looking purchase: the LGA2011 platform is end-of-life, PCIe 3.0 is the bandwidth ceiling, and DDR3 memory falls well behind DDR4 and DDR5 on modern workstation platforms. The value proposition is price-per-core at a high base clock for users who know the platform's constraints and are building deliberately within them. Thermal management is non-negotiable — a proper LGA2011 tower cooler or server heatsink rated for 130W is required to sustain rated turbo frequencies under load.

Key Features

Intel Xeon E5-2667 v2 SR19W

Processor Base Frequency: 3.30 GHz

25 MB Intel Smart Cache

Number of Cores: 8

Sockets Supported: FCLGA2011

Specifications

Model
Xeon E5-2667 v2 (SR19W)
Cores / Threads
8 / 16
Base Frequency
3.30 GHz
Max Turbo Frequency
4.00 GHz
Cache
25MB Intel Smart Cache
Socket
FCLGA2011
TDP
130W
QPI Links
2 x 8 GT/s
Memory Support
DDR3/DDR3L ECC RDIMM/LRDIMM, 4-channel, up to 1866 MHz
Condition
Renewed

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Pros & Cons

👍 Pros

  • 3.30GHz base clock with 4.00GHz max turbo sustains high single-threaded performance for transactional workloads that don't scale across all 8 cores simultaneously
  • 8-core, 16-thread configuration at 3.30 GHz base and 4.00 GHz single-core turbo delivers high single-thread and multi-thread throughput for compute-intensive workloads
  • 25MB Intel Smart Cache — the largest LLC in the E5-2600 v2 family — reduces DRAM access latency for cache-resident workloads including database operations and simulation steps
  • 25MB of Intel Smart Cache at the LLC level reduces DRAM fetch latency for working sets that fit in cache, directly improving throughput on data-intensive server applications
  • 8 physical cores with 16 threads provide sufficient parallelism to host multiple concurrent VMs or run parallel batch jobs without core contention
  • Two QPI links at 8 GT/s each enable efficient dual-socket scaling, doubling core count to 16 physical cores in a verified 2P configuration on a compatible board
  • Four-channel DDR3/DDR3L ECC memory support enables error-correcting operation critical for data integrity in production workstation and server environments
  • Dual-socket NUMA architecture (2× QPI links) enables two of these CPUs in one server for 16 cores and 32 threads, nearly doubling throughput for scale-out workloads
  • Renewed pricing puts Haswell-EP server performance significantly below new silicon cost — viable for budget-constrained lab, dev, or small business server builds
  • Renewed pricing puts a high-clock-speed 8-core workstation CPU well below the cost of equivalent performance on newer-generation platforms

👎 Cons

  • 130W TDP demands robust active cooling and a power supply with adequate headroom — in dual-socket configurations, CPU thermal budget alone approaches 260W before storage and RAM
  • 130W TDP — the highest in the E5-2600 v2 lineup — requires a verified 130W+ heatsink and adequate chassis airflow; thermal throttling is a real risk in poorly ventilated enclosures
  • LGA2011 platform is end-of-life — no new motherboards, limited BIOS updates, and PCIe 3.0 x8 per CPU slot caps bandwidth for modern GPUs and NVMe adapters
  • FCLGA2011 (v1/v2) platform is end-of-life; no further microcode or chipset updates will be issued, leaving known speculative execution vulnerabilities (Spectre/Meltdown) incompletely mitigated on some boards
  • DDR3 memory support limits the platform to an older, increasingly scarce memory standard — large capacity DDR3 RDIMM prices have risen as supply contracts
  • Four-channel DDR3-1866 delivers approximately 59 GB/s peak bandwidth — well behind the 100+ GB/s available on current DDR4 workstation platforms
  • As a renewed CPU, full-load turbo frequency stability is not factory-certified — verify with the seller whether stress testing under rated turbo was performed
  • Four memory channels deliver peak bandwidth well below what DDR4 platforms provide — memory-bandwidth-bound workloads will hit this ceiling before running out of compute
  • No PCIe 4.0 support — the LGA2011 platform is limited to PCIe 3.0, capping NVMe SSD and GPU bandwidth at PCIe 3.0 speeds
  • No AVX-512 support — Ivy Bridge-EP supports AVX2 but not the wider 512-bit SIMD instruction set leveraged by optimized scientific computing and AI inference workloads

Frequently Asked Questions

It uses the FCLGA2011 socket (LGA2011-0), which is compatible with Intel C602/C604 chipset server boards and select high-end desktop (HEDT) X79 platform motherboards. Note: FCLGA2011-3 (Haswell-EP) boards for E5 v3 processors use the same socket physically but are NOT electrically compatible — confirm your board's supported CPU list before purchasing.
The E5-2667 v2 uses the LGA2011 socket (FCLGA2011) and requires an Intel C602 or C606 chipset-based motherboard on the Ivy Bridge-EP platform. It is not compatible with Haswell-EP (E5-2600 v3), Broadwell-EP (v4), or any consumer Intel desktop socket.
Yes — the E5-2667 v2 includes two QPI links at 8 GT/s each, enabling dual-socket installations. In a verified 2P board, two E5-2667 v2 CPUs deliver 16 physical cores and 32 threads with cache coherence maintained across sockets via QPI interconnect.
The Xeon E5-2667 v2 supports up to 768GB of registered ECC DDR3 memory per socket across four memory channels at speeds up to DDR3-1866. In a dual-socket configuration, total addressable memory reaches 1.5TB, which is the primary reason this platform remains relevant for memory-intensive server workloads.
Single-threaded or lightly-threaded workloads — database queries, ERP transactions, legacy application servers, and certain simulation codes — benefit most from the 4.0GHz turbo. With 8 cores and 16 threads, it also handles moderately parallel tasks like virtual machine hosting, where per-core performance directly affects VM responsiveness.
At 130W TDP — the highest in the E5-2600 v2 lineup — this chip requires a server-grade heatsink rated for at minimum 130W continuous dissipation. In a dual-socket 2P configuration, chassis airflow must be verified to prevent thermal throttling under sustained workloads.
The 25MB LLC (Last Level Cache) is shared across all 8 cores, reducing main memory latency for workloads whose active dataset fits within it. Database queries, simulation steps, and rendering tile passes benefit measurably. Workloads exceeding 25MB working sets will incur DDR3 DRAM latency on cache misses.
The TDP is 130W, which is on the higher end for the LGA2011 platform. It requires an active cooling solution rated for 130W TDP or higher — passive cooling is not viable. Verify that your server chassis or workstation cooling assembly supports a 130W LGA2011 processor before installation.
Renewed CPUs have been tested for functionality — core count, clock speed, and cache are verified to match specifications. The risk is primarily in physical condition: inspect the LGA2011 socket for bent pins on the motherboard side before installation. Functionally, CPUs rarely fail if they test correctly; the renewed designation affects cosmetic packaging, not silicon reliability.
Four-channel DDR3/DDR3L ECC RDIMM or LRDIMM at up to 1866 MHz per socket. Maximum capacity is up to 768GB per socket with LRDIMMs. ECC error-correcting memory is supported and strongly recommended for workstation and server deployments where data integrity is required.