Thermaltake
Thermaltake CL-O023-GROSGM-A TG-30 Thermal Compound 4g
★★★★★
Ensure Optimal Heat Transfer for Your CPU and GPUThe Thermaltake TG-30 Premium Thermal Compound is engineered to effectively lower CPU and GPU temperatures. Featuring diamond powder for enhanced thermal conductivity, it maximizes heat transfer and ensures long-lasting performance. Specifications:...
$8.99*
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*Price sourced from Amazon.com. Last updated:Jul 14, 2026.Price and availability are subject to change.
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Overview
Ensure Optimal Heat Transfer for Your CPU and GPU
The Thermaltake TG-30 Premium Thermal Compound is engineered to effectively lower CPU and GPU temperatures. Featuring diamond powder for enhanced thermal conductivity, it maximizes heat transfer and ensures long-lasting performance.
Specifications:
- Brand: Thermaltake
- Model: CL-O023-GROSGM-A
- Type: Premium CPU/GPU Heatsink Thermal Compound
- Weight: 4g
- Thermal Conductivity: 4.5 W/m-k
- Color: Gray
- Viscosity: 76 Pa-s
- Thermal Impedance: 0.185°C -in /W
- Density: 2.55 g/cm³
Key Features
[Performance Compound] Contains diamond powder for higher heat transfer providing a thermal conductivity of 4.5 W/m-k.
[All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.
[Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.
[Sustainability and Safety] The TG-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking
Specifications
Product Type
Thermal Compound
Weight
4g
Key Ingredient
Diamond powder
Thermal Conductivity
4.5 W/m-k
Application Features
Easy to apply, honeycomb stencil included
Electrical Conductivity
Non-electrically conductive
Pros & Cons
👍 Pros
- Contains diamond powder, providing higher heat transfer for effective thermal conductivity of 4.5 W/m-k
- Comes as an all-in-one application kit, including tools for cleaning, prep, and installation of the compound
- Specially formulated to spread easily over the included honeycomb stencil, ensuring consistent application
- Designed to be non-electrically conductive, eliminating the risk of short circuits during use
- Offers a longer lifespan, minimizing issues like dry-out or cracking over time for sustained performance
👎 Cons
- Specific details on the quantity of thermal compound included are not provided beyond "4g" which is a small amount
- The honeycomb stencil ensures consistent application but might be specific to certain CPU sizes or shapes
- While non-electrically conductive, specific information about its non-corrosive properties is not detailed
- The thermal conductivity of 4.5 W/m-k is good, but some high-performance compounds offer even higher values
- The cleaning and prep tools are included, but their reusability or specific types are not described
Frequently Asked Questions
What is the thermal conductivity of Thermaltake TG-30 thermal compound?
The Thermaltake TG-30 thermal compound offers a thermal conductivity of 4.5 W/m-k, thanks to its diamond powder content.
Does this thermal compound come with all necessary application tools?
Yes, the TG-30 comes as an all-in-one application kit, including tools to clean, prep, and install the compound.
Is the application process for this thermal compound difficult?
No, it is specially formulated for easy spreading over the included honeycomb stencil, ensuring a neat and consistent application.
Is the Thermaltake TG-30 electrically conductive?
No, the TG-30 is a non-electrically conductive compound, which eliminates the risk of short circuits in your hardware.
What contributes to the performance of this thermal compound?
The TG-30 contains diamond powder, which enhances heat transfer and contributes to its overall performance.
Will this thermal compound dry out or crack easily over time?
The TG-30 is designed to offer a longer lifespan, minimizing dry-out or cracking, providing sustained performance.
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