
Thermaltake CL-O023-GROSGM-A TG-30 Thermal Compound 4g
Ensure Optimal Heat Transfer for Your CPU and GPUThe Thermaltake TG-30 Premium Thermal Compound is engineered to effectively lower CPU and GPU temperatures. Featuring diamond powder for enhanced thermal conductivity, it maximizes heat transfer and ensures long-lasting performance. Specifications:...
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Overview
Ensure Optimal Heat Transfer for Your CPU and GPU
The Thermaltake TG-30 Premium Thermal Compound is engineered to effectively lower CPU and GPU temperatures. Featuring diamond powder for enhanced thermal conductivity, it maximizes heat transfer and ensures long-lasting performance.
Specifications:
- Brand: Thermaltake
- Model: CL-O023-GROSGM-A
- Type: Premium CPU/GPU Heatsink Thermal Compound
- Weight: 4g
- Thermal Conductivity: 4.5 W/m-k
- Color: Gray
- Viscosity: 76 Pa-s
- Thermal Impedance: 0.185°C -in /W
- Density: 2.55 g/cm³
Key Features
[Performance Compound] Contains diamond powder for higher heat transfer providing a thermal conductivity of 4.5 W/m-k.
[All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.
[Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.
[Sustainability and Safety] The TG-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking