Thermaltake

Thermaltake TG-60 Liquid Metal Thermal Compound - 1g

4.7 (1246 reviews)
52W

Thermaltake's TG-60 liquid metal compound delivers 52 W/m-K thermal conductivity for extreme CPU and GPU cooling.

$12.99*
Check availability

*Price sourced from Amazon.com. Last updated:Jul 14, 2026.Price and availability are subject to change.

Affiliate Disclosure: Studio Supplies may earn a commission from qualifying purchases made through links on this page, at no additional cost to you. This helps support our editorial team.

Notice a mistake? Let Us Know

Overview

The Thermaltake TG-60 is a liquid metal thermal compound engineered for enthusiasts and overclockers who demand the absolute best heat transfer between their CPU or GPU die and the cooling solution. With a thermal conductivity rating of 52 W/m-K — far exceeding the 5–12 W/m-K range of conventional thermal pastes — the TG-60 can deliver measurable temperature reductions that translate directly into higher sustained clock speeds and quieter fan operation. Its ultra-low viscosity of 0.0018 Pa-s allows the compound to spread into an extremely thin, uniform layer, minimizing thermal impedance at just 0.12°C-in²/W.

Because the TG-60 is a gallium-based liquid metal, it is electrically conductive and must be applied exclusively to copper or nickel-plated heatsink surfaces — never bare aluminum, which will corrode on contact. Thermaltake includes cotton swabs, alcohol pads, and a precision pinhead applicator in the package to facilitate clean, controlled application and removal. The anti-oxidation formulation helps the compound maintain its thermal performance over extended use without degradation, and its operating range of 3°C to 200°C covers all realistic computing scenarios. At 1 gram per tube, the TG-60 provides enough compound for one to two applications, making it a targeted purchase for specific high-performance builds rather than a general-purpose supply.

Key Features

Designed for high performance CPU and GPU

High Thermal Conductivity of 52W/m-k

Excellent Stability

Enhanced Cooling Efficiency

Anti-Oxidation

Specifications

Brand
Thermaltake
Model
TG-60
Part Number
CL-O034-GROSGM-B
Type
Liquid Metal Thermal Compound
Thermal Conductivity
52 W/m-K
Electrical Conductivity
7.28 × 10⁶ μS/cm
Density
6.2 g/cm³
Viscosity
0.0018 Pa-s
Thermal Impedance
0.12°C-in²/W
Melting Temperature
3°C
Operating Temperature
3°C – 200°C
Weight
1 g
Compatible Surfaces
Copper, Nickel-plated
Included Accessories
Cotton Swabs × 2, Alcohol Pads × 2, Pinhead × 1

Pros & Cons

👍 Pros

  • 52 W/m-K thermal conductivity dramatically outperforms conventional thermal pastes
  • Anti-oxidation formula maintains performance stability over time
  • Includes cotton swabs, alcohol pads, and pinhead applicator for clean application
  • Very low viscosity (0.0018 Pa-s) allows thin, even spreading across the contact surface

👎 Cons

  • Electrically conductive — accidental spillage onto PCB components can cause short circuits
  • Only safe for copper and nickel-plated surfaces, not compatible with aluminum heatsinks
  • 1-gram quantity provides enough for only one or two applications
  • Application requires more care and precision than standard thermal paste
  • Melting point of 3°C means the compound may partially solidify in very cold environments

Frequently Asked Questions

The TG-60 is suitable for copper and nickel-plated surfaces only. It should not be applied to bare aluminum heatsinks, as liquid metal can cause a corrosive reaction with aluminum.
At 52 W/m-K, the TG-60 delivers roughly 5 to 10 times the thermal conductivity of conventional silicone-based thermal pastes, which typically range from 5 to 12 W/m-K.
Yes, the TG-60 has an electrical conductivity of 7.28 × 10⁶ μS/cm, so it must be applied carefully to avoid contact with any electrical components, PCB traces, or capacitors surrounding the CPU or GPU die.
The package includes 1 gram of liquid metal compound, two cotton swabs, two alcohol pads, and one application pinhead for precise application and cleanup.
The TG-60 operates between 3°C and 200°C, with a melting temperature of 3°C, meaning it remains in liquid form under virtually all normal computing conditions.