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Ayylltx
Ayylltx JINGSHA X99 Dual Xeon Motherboard Kit with E5-2698 v3
A ready-matched dual-Xeon foundation pairing a JINGSHA X99 board with an E5-2698 v3 processor and 64GB of DDR4 in one kit
$1,001.32*
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*Price sourced from Amazon.com. Last updated:Aug 02, 2026.Price and availability are subject to change.
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Overview
Key Features
Enhanced Power Solution:premium chokes and capacitors for steady power delivery
Advanced Thermal Armor: Advanced heatsinks for better heat dissipation
Specifications
Brand
Ayylltx
Board Platform
JINGSHA X99
Configuration
Dual Xeon (dual-socket)
Included Processor
Intel Xeon E5-2698 v3
Memory Included
4 x 16GB (64GB total)
Memory Type
DDR4
Power Design
Enhanced power solution with premium chokes and capacitors
Cooling
Advanced Thermal Armor heatsinks
Kit Type
Motherboard, CPU, and RAM set
Frequently Asked Questions
What exactly comes in this JINGSHA X99 kit versus what I need to buy separately?
The kit includes the JINGSHA X99 dual-socket board, an Intel Xeon E5-2698 v3 CPU, and four 16GB DDR4 modules. You'll still need a CPU cooler, storage, a power supply, and a case to complete the build.
Is this dual-Xeon setup better for gaming or for multi-core workloads?
It's aimed at multi-core work. The dual E5-2698 v3 layout favors heavily threaded tasks like rendering and virtualization, while single-core speed trails modern desktop chips, making it a weaker fit for gaming.
How much memory does the kit include and what type is it?
The kit ships with 64GB of DDR4, arranged as four 16GB modules. That gives a workable baseline for virtualization or rendering without buying memory separately.
What does the board do to keep power stable under heavy load?
The board uses an enhanced power solution with premium chokes and capacitors, a design the manufacturer says is meant to keep power delivery steady when the dual-Xeon configuration runs under sustained load.
How is heat handled on this motherboard?
Cooling is addressed with what the maker calls Advanced Thermal Armor — a set of heatsinks positioned to improve heat dissipation across the board during long high-utilization sessions.