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Cooler Master RR-T812-24PK-R1 TPC 812 CPU Cooler — main product image
Cooler Master

Cooler Master RR-T812-24PK-R1 TPC 812 CPU Cooler

Unleash Maximum Cooling PotentialIntroducing the Cooler Master TPC 812, a cutting-edge CPU cooler engineered to dissipate extreme heat generated during overclocking and intense computing tasks. This innovative design combines vertical vapor chamber technology with heat pipes to deliver unparallel...

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Overview

Unleash Maximum Cooling Potential

Introducing the Cooler Master TPC 812, a cutting-edge CPU cooler engineered to dissipate extreme heat generated during overclocking and intense computing tasks. This innovative design combines vertical vapor chamber technology with heat pipes to deliver unparalleled cooling performance.

Specifications

  • Model: RR-T812-24PK-R1
  • CPU Socket:
    • Intel Socket: LGA 2011 / 1366 / 1156 / 1155 / 775
    • AMD Socket: FM2 / FM1 / AM3+ / AM3 / AM2+ / AM2
  • CPU Support:
    • Intel: Core™ i7 Extreme / Core™ i7 / Core™ i5 / Core™ i3 / Core™2 Extreme / Core™2 Quad / Core™2 Duo / Pentium / Celeron
    • AMD: FX-Series / A-Series / Phenom™ II X4 / Phenom™ II X3 / Phenom™ II X2 / Phenom™ X4 / Phenom™ X3 / Athlon™ II X4 / Athlon™ II X3 / Athlon™ II X2 / Athlon™ X2 / Athlon™ / Sempron™
  • Dimension: 138 x 103 x 163mm (5.4 x 4.1 x 6.4 in)
  • Heat Sink Dimensions: 134 x 74 x 158 mm (5.3 x 2.9 x 6.2 in)
  • Heat Sink Material: Copper Base / 2 Vapor Chambers, 6 Heatpipes / Aluminum Fins
  • Heat Sink Weight: 826g (1.83 lb)
  • Heat Pipes Dimensions: ø6mm
  • Fan Dimension: 120 x 120 x 25mm (4.7 x 4.7 x 1 in)
  • Fan Speed: 600 – 2,400 RPM (PWM) ± 10% (1,600 RPM with Silent Mode Adapter)
  • Fan Airflow: 19.17 - 86.15 CFM ± 10% (59.54 CFM @ 1600RPM)
  • Fan Air Pressure: 0.31 – 4.16 mm H2O ± 10% (1.99mm H2O @ 1600RPM)
  • Fan Life Expectancy: 40,000 hrs
  • Fan Noise Level (dB-A): 19 - 40 dBA
  • Bearing Type: Long Life Sleeve Bearing
  • Connector: 4-Pin
  • Fan Rated Voltage: 12 VDC
  • Fan Rated Current: 0.2A
  • Power Consumption: 2.4W
  • Maximum TDP: 300W
  • Fan Weight: 152g (0.34 lb)
  • Warranty: 2 years

Key Features

The TPC 812 uses 2 separate cooling technologies to transfer heat - heatpipes and vertical vapor chambers

Ready for overclocking, benchmarking and silent cooling

The first ever CPU heatsink to use vertical vapor chamber technology

100% pure polished copper base - combined with improved soldering technologies for the best thermal transfer

Special fin design - heatsink receives concentrated cold airflow

Compatible CPU Sockets - Intel: LGA 2011/1366/1156/1155/775 and AMD: FM1/FM2/AM3+/AM3/AM2+/AM2

Improved air pressure design and fan mounting system

Specifications

Cooling Technologies
Heatpipes, Vertical Vapor Chambers
Base Material
100% Pure Polished Copper
Intel CPU Socket Compatibility
LGA 2011, LGA 1366, LGA 1156, LGA 1155, LGA 775
AMD CPU Socket Compatibility
FM1, FM2, AM3+, AM3, AM2+, AM2
Fin Design
Special, for concentrated cold airflow
Fan Mounting System
Improved air pressure design

Frequently Asked Questions

The TPC 812 is unique because it is the first CPU heatsink to combine both traditional heatpipes and innovative vertical vapor chamber technologies for enhanced heat transfer.
Yes, the Cooler Master TPC 812 is explicitly stated to be ready for overclocking, benchmarking, and silent cooling applications.
The cooler features a 100% pure polished copper base, which, combined with improved soldering, is designed for optimal thermal transfer.
This cooler is compatible with a wide range of Intel sockets including LGA 2011/1366/1156/1155/775 and AMD sockets FM1/FM2/AM3+/AM3/AM2+/AM2.
The TPC 812 incorporates a special fin design that ensures the heatsink receives a concentrated cold airflow, contributing to improved cooling efficiency.

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