Cooler Master
Cooler Master Thermal Pad 2.0 High Performance 13.3W/m.k
★★★★★
3W
Achieve Superior Cooling Performance with Cooler Master Thermal Pad 2.0 Cooler Master’s Thermal Pad 2.0 is an innovative solution for cooling electronic devices and components. Formulated with nano zinc oxide and nano alumina, this thermal pad delivers high thermal conductivity for rapid and effi...
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Overview
Achieve Superior Cooling Performance with Cooler Master Thermal Pad 2.0
Cooler Master’s Thermal Pad 2.0 is an innovative solution for cooling electronic devices and components. Formulated with nano zinc oxide and nano alumina, this thermal pad delivers high thermal conductivity for rapid and efficient heat dissipation.
Specifications:
- Thermal Conductivity: 13.3 W/m.k
- Material: Nano zinc oxide and nano alumina
- Adhesive: Double-sided
- Properties: Non-toxic, non-corrosive, electrically insulated
- Application: Suitable for electronics and devices
Key Features
Formulated with Nano Elements: Nano zinc oxide and nano alumina particles deliver a thermal conductivity of 13.3 w/mK for rapid cooling, suitable for a wide range of electronics and devices.
Non-toxic and Non-corrosive: Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening
Double-sided Adhesive: Provides seamless and secure contact between surfaces
Versatile and Easy Application: Easily cut to the perfect size for your application
Specifications
Thermal Conductivity
13.3 W/mK
Composition
Nano zinc oxide, Nano alumina particles
Properties
Non-toxic, Non-corrosive, Electrically insulated, Heat resistant
Adhesive
Double-sided
Application
Versatile, Easy to cut
Frequently Asked Questions
What is the thermal conductivity rating of this Cooler Master thermal pad?
This Cooler Master thermal pad has a high thermal conductivity of 13.3 W/mK, formulated with nano zinc oxide and nano alumina particles for rapid cooling.
Is this thermal pad safe to use with electronic components?
Yes, it is non-toxic and non-corrosive, with electrically insulated and heat-resistant properties, ensuring it is safe for a wide range of electronics and devices.
Does this thermal pad harden over time?
No, its formula is designed to prevent hardening, maintaining its heat-resistant properties for consistent performance.
How is this thermal pad secured to surfaces?
It features a double-sided adhesive, which provides seamless and secure contact between the surfaces for efficient heat transfer.
Can this thermal pad be customized for different component sizes?
Yes, it is versatile and easy to apply, as it can be easily cut to the perfect size required for your specific application.
What types of devices is this thermal pad suitable for?
It is suitable for a wide range of electronics and devices, delivering rapid cooling performance due to its high thermal conductivity.
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