Cooler Master

Cooler Master TPX-NOPP-9020-R1 2.0mm High Performance Thermal Pad

3w

13.3 W/mK nano-element conductivity bridges heatsink gaps on GPUs, VRMs, and SSDs where thermal paste alone can't reach.

$21.87*
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*Price sourced from Amazon.com. Last updated:Sep 14, 2026.Price and availability are subject to change — details.

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Overview

The Cooler Master TPX-NOPP-9020-R1 is a 2.0mm thermal pad rated at 13.3 W/mK, formulated with nano-particle elements to achieve a conductivity level that sits well above the commodity thermal pad market. To put that number in context: a typical budget pad runs 3–6 W/mK, while mid-tier options reach 8–10 W/mK. At 13.3 W/mK, this pad occupies the upper tier of the non-liquid-metal thermal interface category. The 2.0mm thickness targets the gap-filling role — bridging the physical space between VRAM chips, VRM MOSFETs, M.2 controller chips, and their respective heatsink surfaces, where that gap is too large for paste but needs reliable thermal contact to keep temperatures in check under sustained load.

In practice, this pad is most valuable in GPU rebuilds, laptop thermal refreshes, and custom cooling projects where components are running hot due to dried-out or absent factory pads. The cuttable sheet format gives flexibility for non-standard heatsink contact patterns, and the double-sided adhesive eliminates the alignment frustration common to slippery non-adhesive pads. The electrically insulated formulation is a non-negotiable for VRAM and VRM work, where pads frequently span traces and adjacent components. This isn't a product you'll notice in isolation — its value shows up in sustained clock speeds under load and thermal headroom recovered after a proper re-pad.

Key Features

FORMULATED WITH NANO ELEMENTS - 13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.

NON-TOXIC AND NON-CORROSIVE - Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.

DOUBLE-SIDED ADHESIVE - Provides seamless and secure contact between surfaces.

VERSATILE AND EASY APPLICATION - Easily cut to the perfect size for your application.

WIDE RANGE OF APPLICATION - Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.

Specifications

Thickness
2.0mm
Thermal Conductivity
13.3 w/mK
Properties
Non-toxic, Non-corrosive, Electrically insulated, Heat resistant
Adhesive Type
Double-sided

Frequently Asked Questions

It means this pad transfers heat significantly faster than budget thermal pads, which typically land in the 3–6 W/mK range. In practical terms, you can expect measurably lower junction temperatures on components like VRAM, VRMs, and M.2 SSDs where the pad bridges the physical gap between the chip and heatsink — a gap that thermal paste can't reliably fill due to its inability to maintain contact across distances.
No — and it shouldn't. At 2.0mm, this pad is designed to fill gaps between components and heatsinks, not for direct die-to-cooler contact where ultra-thin paste or liquid metal is appropriate. Using it on a bare CPU die would introduce unnecessary thermal resistance from the extra material thickness.
Yes. The pad is electrically insulated, so bridging across adjacent components or traces won't cause a short circuit. This is critical for VRAM and VRM applications where pads often span multiple chips in close proximity.
The pad sheet can be cut with scissors or a clean blade to any shape required. Measure the VRAM chip array or the contact area on your heatsink, mark the pad, and cut. The double-sided adhesive holds the cut piece in place during installation.
It does increase teardown effort compared to non-adhesive pads. The adhesive bond is firm enough that pulling the heatsink will require deliberate separation — be prepared for that during GPU disassembly. It won't damage components if removed carefully.