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Thermaltake CL-W228-CU00BL-A Pacific C360 DIY Liquid Cooling Radiator — main product image
Thermaltake CL-W228-CU00BL-A Pacific C360 DIY Liquid Cooling Radiator
Thermaltake CL-W228-CU00BL-A Pacific C360 DIY Liquid Cooling Radiator
Thermaltake CL-W228-CU00BL-A Pacific C360 DIY Liquid Cooling Radiator
Thermaltake CL-W228-CU00BL-A Pacific C360 DIY Liquid Cooling Radiator
Thermaltake CL-W228-CU00BL-A Pacific C360 DIY Liquid Cooling Radiator
Thermaltake CL-W228-CU00BL-A Pacific C360 DIY Liquid Cooling Radiator
Thermaltake

Thermaltake CL-W228-CU00BL-A Pacific C360 DIY Liquid Cooling Radiator

High-density copper radiator with reflow-soldered construction delivers efficient heat dissipation for custom liquid cooling loops.

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Overview

The Thermaltake Pacific C360 is a 360mm copper radiator designed for custom PC liquid cooling loops. Its all-copper fin and tube construction delivers strong thermal conductivity while eliminating the galvanic corrosion concerns that arise when mixing aluminum and copper in the same loop. The radiator uses reflow soldering at 250°C to bond its components, a manufacturing method that creates stronger, more consistent joints compared to traditional soldering — reducing the risk of cracks and leaks over the life of the unit.

At just 29.5mm thick, the Pacific C360 is a slim-profile radiator that fits into cases where space behind the fan mounts is limited. It measures 399mm long by 119mm wide and weighs 741g, making it manageable to mount in most mid-tower and full-tower enclosures with 360mm radiator support. The two G¼" threaded ports accept standard custom loop fittings. The high-density copper fins are optimized to perform at both low and high airflow, so the radiator works well whether paired with quiet, low-RPM fans or higher-performance units pushing more air through the fins.

Key Features

Fitment - engineered with a 27mm thickness radiator along with a single-row 12-set flat tube design and brass Tank for best thermal capacity.

High-density copper fins - Designed to accommodate high air volume (fin per inch: 14).

Reflow soldering - high-quality and high-temperature soldering at 482℉/250℃ ensures optimal thermal transfer with full strength on all connected area avoiding cracking and fail over time.

Optimized heat Dispatching - optimized for efficiently pulling heat away from the power-dissipating components thus achieving maximum heat dissipation at both low and high airflow operation.

Stainless steel side panels - engineered with stainless steel made side panels that increase durability and strength of the radiator and reduce the weight.

2 years warranty

Specifications

Brand
Thermaltake
Model
CL-W228-CU00BL-A
Radiator Size
360mm (3 x 120mm fan slots)
Dimensions
399 x 119 x 29.5 mm
Weight
741 g
Material
Copper
Fin Density (FPI)
17
Flat Tubes
12 sets
Thread Size
G¼" x 2
Soldering Method
Reflow soldering (250°C / 482°F)

Frequently Asked Questions

The radiator uses standard G¼" threads, which are compatible with the vast majority of custom liquid cooling fittings.
The C360 is a 360mm radiator designed to accommodate three 120mm fans (or a single 360mm fan bracket, depending on your case configuration).
The radiator is constructed entirely from copper, which avoids the galvanic corrosion issues that can arise from mixing aluminum and copper components in the same loop.
The product description lists 14 FPI in the features and 17 FPI in the specifications. Verify the current spec with the manufacturer if precise fin density is critical to your build planning.
The radiator measures 29.5mm thick (excluding fans), making it a slim-profile design that fits in most mid-tower and full-tower cases with 360mm radiator support.

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